🔧One platform meets all your needs: The upgraded preheating and layering platform features glue removal, lamination, soldering, desoldering, layering, reflow, and cooling.
🔧2025 Newly upgraded with a real-time temperature monitoring screen and heat dissipation function
🔧Reaches 300°C in 45 seconds
🔧Faster preheating, higher efficiency
🔧 The heat dissipation function repairs chips more quickly and conveniently.
