Chip grinding is one of those processes everyone calls “simple”…
until yield starts dropping, and no one wants to own it.
Manual grinding works—when the right operator is on shift.
Thickness control, pressure, “feel”… all live in someone’s hands.
Great for R&D. Risky for production.
The problem?
Manual grinding fails quietly. Chips look fine. Measurements pass.
Cracks show up later, somewhere else, and grinding is already “cleared.”
Automatic grinding is boring.
Same pressure. Same feed rate. Same result. Every time.
No hero operators. No “only works when Zhang is here” processes.
Yes, automation costs money.
So do scrap, rework, and endless root-cause meetings.
If your grinding process depends on experience instead of parameters,
that’s not control—it’s luck.
In semiconductor manufacturing,
Boring processes usually have the best yield.