In the smartphone repair industry, balancing precision and efficiency has always been a critical challenge for technicians. Processes like screen adhesive bonding, battery replacement, and motherboard alignment require not only accurate pressure control but also stable thermal conditions to ensure optimal adhesive performance. Traditional tools often lead to repair failures or device damage due to uneven pressure, insufficient heat distribution, or poor cooling. Enter the BY1 Automatic Pressure Retention Machine—a game-changer featuring 0-100KG adjustable pressure, four-sided uniform heating, and a high-efficiency cooling system—now redefining industry standards.
1. Core Technology: Precision Pressure Control & Intelligent Thermal Management
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0-100KG Adjustable Pressure for Universal Compatibility
Whether handling slim iPhones or foldable smartphones with complex structures, the BY1 allows precise pressure adjustment via a digital interface or rotary knob (with 0.1KG micro-adjustments on select models). This eliminates risks like screen cracks from overload or adhesive failure from insufficient pressure. For example, battery replacements typically require 15-30KG, while screen bonding may demand higher pressure ranges. -
Four-Sided Uniform Heating for Consistent Results
Equipped with surround-heating modules, the BY1 ensures repair zones (e.g., screen edges, battery adhesive layers) reach optimal temperatures (70-90°C) within 30 seconds. This softens adhesives evenly while preventing component deformation caused by uneven heating. Compared to single-sided heating tools, success rates improved by over 40%.
2. Advanced Cooling System: 30% Faster Workflow
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Dual-Channel Hurricane Cooling + Smart Thermal Control
After heating, the built-in 12,000 RPM turbofan and dual vents cool the device from 90°C to a safe threshold (below 25°C) in just 3 minutes. This accelerates adhesive curing and slashes turnaround times, ideal for high-volume repair shops. -
Dust-Proof Filter Design
Removable mesh filters on vents block dust and debris from entering the machine, extending its lifespan.
3. Versatile Applications: From Batteries to Motherboards
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Battery Replacement: Precise pressure prevents swelling risks; heat softens adhesive for easy removal.
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Screen Bonding: Even pressure eliminates air bubbles, ideal for fragile OLED flex screens.
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Waterproofing Repair: Activates sealants under heat, restoring IP68 ratings during pressure retention.
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Motherboard Reinforcement: Repairs solder joints with constant heat and pressure, reattaching BGA chips.
4. User-Centric Design: Safety Meets Efficiency
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Smart Safety Protections: Auto-shutdown on overheating, pressure limit alerts, and touch-lock functions minimize risks.
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Modular Components: Interchangeable heating pads and pressure plates support custom fixtures, extending compatibility to tablets, smartwatches, and more.
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Silent Mode: Reduces fan noise to <45dB for quiet workshop environments.
Conclusion: An Industrial-Grade Tool for Next-Level Repairs
The BY1 Automatic Pressure Retention Machine doesn’t just solve traditional pain points—it slashes repair times to under 10 minutes per device through intelligent pressure control, uniform heating, and rapid cooling. For high-end repair centers pursuing standardized services or technicians specializing in micro-component repairs, this machine is a strategic investment to boost customer trust and operational efficiency.
Upgrade Your Toolkit Today—Where Precision Pressure Meets Perfect Repairs!
Shop Now: BY1 Phone Pressure Retaining Machine